Package structure of optical module

Abstract

A package structure of an optical module is provided and includes: a light-emitting chip and a light-admitting chip which are disposed at a light-emitting region and a light-admitting region of a substrate, respectively; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively, and forming hemispherical first and second lens portions above the light-emitting chip and the light-admitting chip, respectively; a cover disposed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively, and the first and second lens portions are received in the light-emitting hole and the light-admitting hole, respectively. The encapsulants of the optical module package structure can be of unequal curvature as needed to enhance light emission efficiency of the light-emitting chip and enhance reception efficiency of the light-admitting chip.

Dependencies are inferred from the claim text.