Light emitting module
AssigneeLG Innotek Co., Ltd.
InventorsGun Kyo LEE, Jong Woo LEE, Yun Min CHO
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.
Claims20
A light emitting module comprising:
- a circuit board having a first region and a second region, the first region having a cavity and the second region having a circuit pattern;
- an insulation substrate disposed on the circuit board;
- at least one pad disposed on the insulation substrate;
- and
- at least one light emitting device disposed on the pad,
- wherein a joining structure is disposed between a surface of the circuit board and a bottom surface of the insulation substrate.
A light emitting module comprising:
- a circuit board;
- a heat radiating member disposed below the circuit board;
- an insulation substrate disposed on the circuit board;
- at least one pad disposed on the insulation substrate;
- and
- at least one light emitting device disposed on the pad,
- wherein a joining structure is disposed between a region on the heat radiating member corresponding to the circuit board and a bottom surface of the insulation substrate, and
- wherein the joining structure comprises:
- at least one heat radiating member recess portion formed to be recessed from the region on the heat radiating member corresponding to the circuit board;
- and
- at least one insulation substrate protrusion portion formed to protrude from the bottom surface of the insulation substrate,
- wherein a bottom surface of the at least one insulation substrate protrusion portion contacts a top surface of the at least one heat radiating member recess portion.
A light emitting module comprising:
- a circuit board comprising a metal plate, an insulation layer on the metal plate, and a circuit pattern on the insulation layer;
- an insulation substrate disposed on the circuit board while being formed, at an upper portion thereof, with at least one pad;
- at least one light emitting device disposed on the pad;
- and
- a joining structure disposed between an upper surface of the circuit board and a bottom surface of the insulation substrate,
- wherein the joining structure comprises:
- a circuit board recess portion formed by removing at least a portion of the insulation layer of the circuit board, and
- at least one insulation substrate protrusion portion protruding from the bottom surface of the insulation substrate,
- wherein a bottom surface of the at least one insulation substrate protrusion portion directly contacts a top surface of the circuit board recess portion.
Dependencies are inferred from the claim text.