Package structure of optical module
AssigneeLingsen Precision Industries, Ltd.
InventorsMing-Te TU, Yao-Ting YEH
Life of this patent
Estimating the term…
Abstract
A package structure of an optical module includes: a substrate defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. Accordingly, the optical module package structure simplifies a packaging process and cuts manufacturing costs.
Claims9
A method for packaging an optical module, the method comprising the steps of:
- (a) defining a light-emitting region and a light-admitting region on a substrate;
- (b) connecting electrically a light-emitting chip and a light-admitting chip to the light-emitting region and the light-admitting region of the substrate, respectively;
- (c) forming a transparent encapsulant on the light-emitting chip and the light-admitting chip;
- (d) forming an opaque shielding layer on the encapsulants and the substrate;
- and
- (e) removing the shielding layer above the light-emitting chip and the light-admitting chip.
A package structure of an optical module, comprising:
- a substrate defined with a light-emitting region and a light-admitting region;
- a light-emitting chip disposed at the light-emitting region of the substrate;
- a light-admitting chip disposed at the light-admitting region of the substrate;
- two encapsulants for enclosing the light-emitting chip and the light-admitting chip, respectively;
- and
- a shielding layer formed on the substrate and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively.
Dependencies are inferred from the claim text.