US 2015/0028357 A1 · PACKAGE STRUCTURE OF AN OPTICAL MODULE

Abstract

This invention relates to a package structure of an optical module. A light emitting and light receiving chips are disposed on a light emitting and light receiving region of the substrate, respectively. Two encapsulating gels cover the light emitting chip and the light receiving chip, respectively, and form a first and a second hemispherical lens portions on the light emitting chip and the light receiving chip, respectively. A cover is affixed on the substrate and each of the encapsulating gels and has a light emitting hole and a light receiving hole, wherein the first and the second lens portions are accommodated, respectively. An engaging means is formed on an adjacent surface between each encapsulating gels and the cover in a horizontal direction. Thereby, the package structure of the optical module of the present invention increases the connection region between each encapsulating gels and the cover to enhance the engagement.

Claims10

Dependent claims

A package structure of an optical module, comprising:

a substrate defining a light emitting region and a light receiving region;
a light emitting chip disposed on the light emitting region of the substrate;
a light receiving chip disposed on the light receiving region of the substrate;
two encapsulating gels coated on the light emitting chip and the light receiving chip, respectively, each of the encapsulating gels forming a first lens portion and a second lens portion, each of which is a hemispherical shape, on the light emitting chip and the light receiving chip, respectively;
a cover disposed on the substrate and each of the encapsulating gels, the cover having a light emitting hole and a light receiving hole, the light emitting hole and the light receiving hole being located on the light emitting chip and the light receiving chip, respectively, and the first lens portion and the second lens portion being accommodated in the light emitting hole and the light receiving hole;
and
an engaging means disposed on an adjacent surface between each of the encapsulating gels and the cover in a horizontal direction.

4 more elements

Dependencies are inferred from the claim text.

Package structure of an optical module

Life of this patent

Package structure of an optical module

Life of this patent

Abstract

Claims10