Coupling optical signals into silicon optoelectronic chips

A method for processing signals, the method comprising:

• in a photonic transceiver comprising a CMOS photonic chip, coupling one or more optical signals into a back surface of said CMOS photonic chip, wherein photonic, electronic, or optoelectronic devices are integrated in layers on a front surface of said CMOS photonic chip and said one or more optical signals are received by one or more optical couplers integrated in said layers on said front surface of said CMOS photonic chip.

A system for processing signals, the system comprising:

• a photonic transceiver comprising a CMOS photonic chip with photonic, electronic, or optoelectronic devices integrated in layers on a front surface of said CMOS photonic chip, wherein one or more optical signals are coupled into a back surface of said CMOS photonic chip, and one or more optical couplers integrated in said layers on said front surface of said CMOS photonic chip are operable to receive said one or more optical signals.

A system for processing signals, the system comprising:

• a photonic transceiver comprising a CMOS photonic chip with photonic, electronic, or optoelectronic devices integrated beneath a stack of dielectric layers in a front surface of said CMOS photonic chip, wherein said front surface of said CMOS photonic chip is bonded to a second chip;
• and wherein one or more optical couplers integrated beneath a metal reflector embedded in said dielectric layers receive one or more optical signals coupled into a back surface of said CMOS photonic chip.