Image sensor device with infrared filter adhesively secured to image sensor integrated circuit and related methods
AssigneeStmicroelectronics Pte Ltd
InventorsYonggang JIN, Bin-Hong HUANG
Life of this patent
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Abstract
An image sensor device may include a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity, an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening, and an adhesive bead on the image sensor IC surrounding the image sensing area. Furthermore, an infrared (IR) filter may be within the filter-receiving opening and have peripheral portions contacting the adhesive bead.
Claims20
An image sensor device comprising:
- a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity;
- an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening;
- and
- an adhesive bead on said image sensor IC surrounding the image sensing area;
- an infrared (IR) filter within the filter-receiving opening and having peripheral portions contacting said adhesive bead.
An image sensor device comprising:
- a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity;
- an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening;
- an infrared (IR) filter within the filter-receiving opening;
- an adhesive bead on said image sensor IC surrounding the image sensing area;
- an infrared (IR) filter within the filter-receiving opening and having peripheral portions contacting said adhesive bead;
- and
- an adhesive layer securing said IR filter to adjacent portions of said mounting substrate within the filter-receiving opening;
- said adhesive bead and said adhesive layer each being opaque.
A method for making an image sensor device comprising:
- forming a mounting substrate having an IC-receiving cavity therein and a filter-receiving opening aligned with the IC-receiving cavity;
- mounting an image sensor integrated circuit (IC) within the IC-receiving cavity and having an image sensing area aligned with the filter-receiving opening;
- forming an adhesive bead on said image sensor IC surrounding the image sensing area;
- and
- securing an infrared (IR) filter within the filter-receiving opening and with peripheral portions contacting the adhesive bead.
Dependencies are inferred from the claim text.