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US 2015/0028081 A1Published application
Method for fabricating wire bonding structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsWei-Sheng Lin, Lung-Tang Hung, Meng-Hung Yeh, Zhi-Lun Hsieh, Yude Chu
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Abstract
A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
Claims8
A method for fabricating a wire bonding structure, comprising the steps of:
- providing a substrate having a plurality of bonding pads;
- and
- forming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad.
Dependencies are inferred from the claim text.