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US 2015/0027876 A1Published application
Sputtering system and method of fabricating display device using the same
AssigneeSamsung Display Co., Ltd.
InventorsSeung-Ho CHOI, Jong-Jin Park
Life of this patent
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Abstract
A sputtering system includes a chamber, a plurality of targets, and a substrate holder. The targets are disposed in the chamber. Each target includes a magnet unit disposed therein. The substrate holder is configured to support a substrate in the chamber. The magnet units are configured to generate a magnetic field between the targets. Each of the magnet units includes magnets disposed in two rows.
Claims20
A sputtering system, comprising:
- a chamber;
- a plurality of targets disposed in the chamber, each target comprising a magnet unit disposed therein;
- and
- a substrate holder configured to support a substrate in the chamber,
- wherein the magnet units are configured to generate a magnetic field between the targets, and
- wherein each of the magnet units comprises magnets disposed in two rows.
3 more elements
A method, comprising:
- causing, at least in part, sputtering targets disposed in a chamber to be electrically biased, each of the sputtering targets respectively housing magnets spaced apart from one another, the magnets being configured to generate a magnetic field between the sputtering targets;
- and
- causing, at least in part, particles to collide with the biased sputtering targets, the collisions causing deposition particles to be ejected from the biased sputtering targets,
- wherein the magnetic field restricts a first portion of the deposition particles in a space between the biased sputtering targets and permits a second portion of the deposition particles to be deposited on a substrate disposed in the chamber.
1 more element
Dependencies are inferred from the claim text.