Leadframe and the method to fabricate thereof

#I. Field of the Invention

#The present invention relates to a leadframe, and in particularly, to a leadframe forming a 3D space.

#II. Description of the Prior Art

#The foregoing aspects and many of the accompanying advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description when taken in conjunction with the accompanying drawings, wherein:

#FIG. 1A illustrates a schematic three-dimensional view of a leadframe in accordance with the present invention;

#FIG. 1B illustrates a schematic three-dimensional view of a package structure where at least one device is accommodated in a 3D space formed by the leadframe in FIG. 1A in accordance with the present invention;

#The detailed explanation of the present invention is described as following. The described preferred embodiments are presented for purposes of illustrations and description and they are not intended to limit the scope of the present invention.

#The following embodiments disclose a leadframe and a method for manufacturing the leadframe. The following embodiments also disclose a three-dimensional package structure and a method for manufacturing the three-dimensional package structure. Two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. Two conductive pillars can be formed by a patterning process (e.g., lithography process) to match the requirement of the device size.

#FIG. 1A illustrates a schematic three-dimensional view of a leadframe 100 in accordance with the present invention. The leadframe comprises: a first lead 101 and a second lead 102 spaced apart from each other; a first conductive pillar 103 formed on the first lead 101 by disposing a first via on the first lead 101, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar 103; and a second conductive pillar 104 formed on the second lead 102 by disposing a second via on the second lead 102, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar 104; wherein the first lead 101, the second lead 102, the first conductive pillar 103, and the second conductive pillar 104 forms a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar 103 and the second conductive pillar 104. Preferably, the first conductive material is the same as the second conductive material. FIG. 1B illustrates a schematic three-dimensional view of a package structure where at least one device 105 is accommodated in a 3D space formed by the leadframe 100 in FIG. 1A in accordance with the present invention. In one embodiment, the first conductive pillar 103 and the second conductive pillar 104 are respectively formed on the first corner of the first lead 101 and the second corner of the second lead 102 to form a maximum 3D space for accommodating at least one device. Both of the first conductive pillar 103 and the second conductive pillar 104 has high aspect ratio. Optionally, a molding material (not shown) can encapsulate at least one device 105.