Deposition by spin coating of a patterned thin layer on a substrate
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsThomas SEBASTIEN, Messaoud BEDJAOUI, Aboubakr ENNAJDAOUI
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Abstract
The method for producing a patterned layer of first material on a surface of a substrate comprises the following successive steps: arranging a particle on the surface of the substrate; depositing a resin by spin coating on the surface of the substrate so as to form the patterned layer of first material and a hole passing through the layer of first material and opening onto the particle; the material of the particle and the resin being chosen such that the particle exerts a repulsive interaction with respect to the resin.
Claims9
A method for producing a patterned layer made from first material on a surface of a substrate comprising the following successive steps:
- arranging a particle on the surface of the substrate;
- depositing a resin by spin coating on the surface of the substrate so as to form the patterned layer of first material and a hole passing through the layer of first material and opening onto the particle;
- the material of the particle and the resin being chosen such that the particle exerts a repulsive interaction with respect to the resin.
An electronic component arranged on the surface of a substrate, and comprising:
- a first pad forming an electric contact;
- a first encapsulation layer made from electrically insulating polymer material arranged on the substrate surface and provided with a surface opposite the substrate surface, said first layer being formed so as to comprise a pass-through hole opening onto the first pad;
- a second pad made from electrically conducting material, arranged on the first pad and located in the hole;
- a second electrically conducting encapsulation layer arranged on the surface, the first and second encapsulation layers forming a bilayer totally covering the component with the exception of the second pad;
- wherein the pass-through hole comprises side walls connected to the surface of the first encapsulation layer by a pad made from electrically insulating polymer material, the said pad laterally separating the second pad and the second encapsulation layer.
Dependencies are inferred from the claim text.