Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYong Sang SHIN, Joo Sung PARK
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a printed circuit board capable of increasing reliability by decreasing stress between an insulating layer and solder balls. The printed circuit board includes: an insulating layer part including circuit patterns and connecting lands having solder balls seated thereon and including a plurality of insulating layers; a plurality of connecting pads and non-connecting pads formed at the insulating layer part; and a plurality of reinforcing vias formed in the non-connecting pads and reinforcing a close adhesion state between the insulating layer part and the non-connecting pads.
Claims7
A printed circuit board comprising:
- an insulating layer part including circuit patterns and connecting lands having solder balls seated thereon and including a plurality of insulating layers;
- a plurality of connecting pads and non-connecting pads formed at the insulating layer part;
- and
- a plurality of reinforcing vias formed in the non-connecting pads and reinforcing a close adhesion state between the insulating layer part and the non-connecting pads.
Dependencies are inferred from the claim text.