Pcb having glass core
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYee Na SHIN, Seung Eun Lee
Life of this patent
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Abstract
Disclosed herein is a printed circuit board (PCB) including a glass core for maintaining sufficient rigidity while maintaining a thin thickness to minimize warpage. The PCB includes a glass core having upper and lower surfaces in which pattern formation grooves and through via holes are formed, a plating layer filled in the pattern formation groves and the through via holes, insulating layers stacked on the upper and lower surfaces of the glass core, and solder resist layers formed on the insulating layers via coating.
Claims11
A printed circuit board (PCB),comprising:
- a glass core having upper and lower surfaces in which pattern formation grooves and through via holes are formed;
- a plating layer filled in the pattern formation groves and the through via holes;
- insulating layers stacked on the upper and lower surfaces of the glass core;
- and
- solder resist layers formed on the insulating layers via coating.
A printed circuit board (PCB),comprising:
- a glass core including pattern formation grooves and through via holes and including a cavity for accommodating an electronic device therein;
- a plating layer filled in the pattern formation grooves and the through via holes;
- insulating layers stacked on the upper and lower surfaces of the glass core;
- and
- a solder resist layer formed on the insulating layer via coating.
Dependencies are inferred from the claim text.