US 2015/0027754 A1 · RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

Abstract

A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.

Claims34

Dependent claims

A resin composition containing:

(A) a polyimide having acidic functional groups;
and
(B) a compound having functional groups that react with the acidic functional groups,
wherein (a) a solution rate of the resin composition in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1,
(b) the solution rate of the resin composition in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after a heat history of 180° C. for 60 minutes,
(c) a bleed-out amount of the resin composition is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and
(d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG).

4 more elements

A multilayer printed wiring board, wherein the board is obtained by removing, in a layered product provided with a first conductive layer, a resin composition layer provided on a surface of the first conductive layer, and a second conductive layer provided on a surface of the resin composition layer, a part of the second conductive layer to form an opening portion, removing the resin composition layer exposed to the opening portion by etching using an alkali solution using the second conductive layer with the opening portion formed as a mask, forming a via hole formed in the resin composition layer so that a part of the first conductive layer is exposed, and applying plating to the surface of the second conductive layer including the inside of the via hole, in observing a perpendicular cross section of the via hole, a horizontal distance x from an end surface of the second conductive layer on an inner side of the opening portion to an end portion of the via hole on the second conductive layer side ranges from −30 μm to 0 μm, a horizontal distance y from the end surface of the second conductive layer on the inner side of the opening portion to an end portion of the via hole on the first conductive layer side ranges from −10 μm to 20 μm, and

in TOF-SIMS measurement of the perpendicular cross section of the via hole, in the resin composition layer forming a side wall surface of the via hole, a thickness T in a horizontal direction is 10 μm or more from the side wall surface of a resin modified portion in which a total residual concentration of alkali metal ions contained in the alkali solution is 50 ppm or more.

A method of manufacturing a multilayer flexible wiring board, comprising:

a step of overlapping an outer layer substrate provided with an outer conductive layer and a resin composition layer formed on a surface of the outer conductive layer, and a core substrate comprised of a double-sided flexible substrate with a wiring circuit and a via hole formed so that the resin composition layer is disposed on a surface side of the core substrate;
and
a step of heating and pressurizing overlapped the outer layer substrate and the core substrate on predetermined lamination conditions to laminate,
wherein a vacuum laminator apparatus that has a rubber substrate integrated with a reinforcing material and that is allowed to pressurize and heat is used in the step of laminating the outer layer substrate and the core substrate, and a resin flow amount from a vicinity of the outer conductive layer ranges from 0.001 mm to 1 mm on the lamination conditions that a temperature is in a range of 70° C. to 180° C. and that a pressure is in a range of 0.3 MPa to 3 MPa.

1 more element

Dependencies are inferred from the claim text.

Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same

Life of this patent

Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same

Life of this patent

Abstract

Claims34