Printed circuit board and method of manufacturing same

A method of manufacturing a printed circuit board comprising the steps of:

• forming a conductor trace that has a terminal portion and a wiring portion on a base insulating layer;
• forming a wiring cover layer on the wiring portion of the conductor trace;
• forming a cover insulating layer on the base insulating layer to cover the wiring cover layer;
• and p1 forming a terminal cover layer to cover the terminal portion of the conductor trace, wherein the terminal portion has a thickness smaller than a thickness of the wiring portion, and a difference between the thickness of the terminal portion and the thickness of the wiring portion is not more than 2 μm,
• the step of forming the wiring cover layer includes processing the wiring cover layer such that an end of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion as a first projection, and an end surface of the first projection is positioned at an inner side than an end of the cover insulating layer, and
• the step of forming the terminal cover layer includes forming the terminal cover layer such that part of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of an end of the cover insulating layer as an insert portion, another part of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the first projection as a second projection, the upper surface of the insert portion and the lower surface of the end of the cover insulating layer come into contact with each other, an end surface of the insert portion and the end surface of the first projection come into contact with each other, and an upper surface of the second projection and the lower surface of the first projection come into contact with each other.