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US 2015/0027642 A1Published application
Method for isolating flexible film from support substrate
AssigneeIndustrial Technology Research Institute
InventorsDong-Sen CHEN, Hsiao-Fen WEI, Liang-You JIANG, Yu-Yang CHANG
Life of this patent
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Abstract
Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.
Claims13
A method for isolating a flexible film from a support substrate, comprising:
- providing a support substrate with a top surface;
- subjecting the top surface of the support substrate with a surface treatment, thereby forming a top surface with detachment characteristics;
- forming a flexible film on the top surface of the support substrate;
- and
- isolating the flexible film from the support substrate,
- wherein the surface treatment comprises providing a chemical agent to react with the top surface of the support substrate;
- and
- wherein the chemical agent has the structure represented by
- wherein W is C, Si, or Ge;
- X is S, or Se;
- Y is C, or S;
- R1, R2, and R3 are independent and comprise H, alkenyl group, alkyl group, or —OR;
- R is C1-18 alkyl group;
- R4 is F, Br, I, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof;
- R5 is Li;
- and R6, R7, and R8 are independent and comprise F, Cl, Br, I, alkenyl group, alkyl group, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof.
13 more elements
A method for isolating a flexible film from a support substrate, comprising:
- providing a support substrate with a top surface;
- subjecting the top surface of the support substrate with a surface treatment, thereby forming a top surface with detachment characteristics;
- forming a flexible film on the top surface of the support substrate;
- and
- isolating the flexible film from the support substrate,
- wherein the surface treatment comprises providing a chemical agent to react with the top surface of the support substrate, and the chemical agent has the structure represented by
- wherein W is C, Si, or Ge;
- X is S, or Se;
- Y is C, or S;
- R1, R2, and R3 are independent and comprise H, alkenyl group, alkyl group, or —OR;
- R is C1-18 alkyl group;
- R4 is F, Br, I, Cl, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof;
- R5 is Li;
- and R6, R7, and R8 are independent and comprise F, Cl, Br, I, alkenyl group, alkyl group, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof, and wherein the chemical agent is not trimethyl chlorosilane, or dimethyl dichlorosilane.
11 more elements
A method for isolating a flexible film from a support substrate, comprising:
- providing a support substrate with a top surface;
- subjecting a part of the top surface of the support substrate with a surface treatment, thereby forming a mold release region, wherein an adhesive region is the part of the top surface beyond the mold release region;
- forming a flexible film on the top surface of the support substrate, wherein the flexible film covers the mold release region and the adhesive region;
- forming an electronic element on the flexible film;
- and
- isolating a flexible electronic device from the support substrate, wherein the surface treatment comprises providing a chemical agent to react with the top surface of the support substrate, and the chemical agent has the structure represented by
- wherein W is C, Si, or Ge;
- X is S, or Se;
- Y is C, or S;
- R1, R2, and R3 are independent and comprise H, alkenyl group, alkyl group, or —OR;
- R is C1-18 alkyl group;
- R4 is F, Br, I, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof;
- R5 is Li;
- and R6, R7, and R8 are independent and amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof.
11 more elements
A method for isolating a flexible film from a support substrate, comprising:
- providing a support substrate with a top surface;
- subjecting a part of the top surface of the support substrate with a surface treatment, thereby forming a mold release region, wherein an adhesive region is the part of the top surface beyond the mold release region;
- forming a flexible film on the top surface of the support substrate, wherein the flexible film covers the mold release region and the adhesive region;
- forming an electronic element on the flexible film;
- and
- isolating a flexible electronic device from the support substrate,
- wherein the surface treatment comprises providing a chemical agent to react with the top surface of the support substrate, and the chemical agent has the structure represented by
- wherein W is C, Si, or Ge;
- X is S, or Se;
- Y is C, or S;
- R1, R2, and R3 are independent and comprise H, alkenyl group, alkyl group, or —OR;
- R is C1-18 alkyl group;
- R4 is F, Br, I, Cl, carboxyl group, amino group, amine group, cyano group, amide group, alkyl halide group, or combinations thereof;
- R5 is Li;
- and R6, R7, and R8 are independent and comprise F, Cl, Br, I, alkenyl group, alkyl group, carboxyl group, group, or combinations thereof, and wherein the chemical agent is not trimethyl chlorosilane, or dimethyl dichlorosilane.
12 more elements
Dependencies are inferred from the claim text.