Method of manufacturing rigid-flexible printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYang Je LEE, Jae Ho SHIN, Dek Gin YANG
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
Claims12
A method of manufacturing a rigid-flexible printed circuit board, which comprises:
- providing a first flexible film having a first metal layer on one or both surfaces;
- forming a circuit pattern by patterning the first metal layer;
- forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film;
- forming a circuit pattern by patterning the second metal layer in a rigid domain R;
- providing an anti-oxidation protective layer on the second metal layer in a flexible domain F;
- laminating at least one circuit layer on the second flexible film;
- and
- removing the circuit layer in the flexible domain F.
Dependencies are inferred from the claim text.