Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding

An apparatus for holding semiconductor devices during thermocompression bonding, the apparatus comprising:

• a heater;
• and
• a device for holding a plurality of the semiconductor devices during thermocompression bonding, the device comprising:
• a body;
• a plurality of support surfaces at a first side of the body, each support surface being configured to hold at least one of the semiconductor devices during thermocompression bonding;
• and
• a plurality of internal conduits within the body, each internal conduit extending from an opening of a respective one of the support surfaces at the first side of the body to an opening at a second side of the body,
• wherein the openings at the second side of the body are configured to be connected to separate pneumatic paths to be in fluid communication therewith, each pneumatic path having an independently controlled pneumatic suction force so that the openings of the support surfaces at the first side of the body are operative to selectively hold the one or more of the semiconductor devices against the support surfaces at the first side of the body or to release the same therefrom;
• wherein the device for holding a plurality of semiconductor devices is coupled to the heater;
• wherein the heater is operative to heat the device for holding a plurality of the semiconductor devices to thereby heat the semiconductor devices that are being held.

A method of bonding a plurality of semiconductor devices to a substrate via thermocompression bonding, the method comprising the steps of:

• transferring a plurality of the semiconductor devices from a supply of the semiconductor devices to the substrate using a device for holding a plurality of the semiconductor devices during thermocompression bonding, the device for holding a plurality of the semiconductor devices comprising:
• a body;
• a plurality of support surfaces at a first side of the body, each support surface being configured to hold at least one of the semiconductor devices during thermocompression bonding;
• and
• a plurality of internal conduits within the body, each internal conduit extending from an opening of a respective one of the support surfaces at the first side of the body to an opening at a second side of the body,
• wherein the openings at the second side of the body are configured to be connected to separate pneumatic paths to be in fluid communication therewith, each pneumatic path having an independently controlled pneumatic suction force so that the openings of the support surfaces at the first side of the body are operative to selectively hold the one or more of the semiconductor devices against the support surfaces at the first side of the body or to release the one or more of the semiconductor devices therefrom;
• and
• bonding the semiconductor devices to the substrate via thermocompression bonding.