Semiconductor die singulation methods

A cutting tool comprising:

• a central support section having a major axis;
• a cutting tip;
• a cutting surface adjacent to the cutting tip and extending from the cutting tip toward the central support section terminating in a distal end of the cutting surface wherein the cutting surface is attached to the central support section;
• a depth stop spaced a first distance from the cutting tip toward the central support section wherein, a first volume is formed by a portion of the cutting surface extending from the cutting tip to the depth stop;
• and
• an accumulation region adjacent to the central support section and extending away from the cutting surface, the accumulation region having a second volume that approximates the first volume.

A method of forming a tool for a semiconductor wafer comprising:

• forming the tool to reduce a thickness of a material formed on a semiconductor wafer;
• forming the tool with a cutting tip and cutting surfaces that are configured to penetrate into the material to form reduced thickness regions in the material;
• and
• forming an accumulation region of the tool with a recess having a first volume for accepting portions of the material displaced from within the material by the penetration.