Mechanical Quantity Measuring Device
AssigneeHitachi, Ltd.
InventorsKisho Ashido, Hiroyuki Ohta
Life of this patent
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Abstract
A mechanical quantity measuring device (semiconductor strain sensor) has a semiconductor chip including a plurality of piezoresistive elements formed on a front surface of a semiconductor substrate, a lead wire unit electrically connected to a plurality of electrodes of the semiconductor chip, and a plate member joined to a rear surface of the semiconductor chip. Further, the plate member includes a first region facing the rear surface of the semiconductor chip and a second region provided adjacent to the first region, and a thickness of the plate member in the first region is made larger than a thickness in the second region.
Claims17
A mechanical quantity measuring device comprising:
- a semiconductor chip including a front surface, a plurality of piezoresistive elements formed on the front surface side, a plurality of electrodes formed on the front surface side and electrically connected to the plurality of piezoresistive elements, and a rear surface located on an opposite side to the front surface;
- a lead wire unit including a plurality of wires electrically connected to the plurality of electrodes;
- and
- a plate member including a chip mount surface on which the semiconductor chip is mounted and a mount surface located on an opposite side to the chip mount surface and fixed to an object to be measured, to which the semiconductor chip is fixed via a joining member so that the rear surface of the semiconductor chip may face the chip mount surface,
- wherein the plate member includes a first region facing the rear surface of the semiconductor chip and second regions provided on both sides with the first region in between, and
- a thickness of the plate member in the first region is larger than a thickness in the second region at a peripheral edge of the plate member.
A mechanical quantity measuring device comprising:
- a semiconductor chip including a front surface, a plurality of piezoresistive elements formed on the front surface side, a plurality of electrodes formed on the front surface side and electrically connected to the plurality of piezoresistive elements, and a rear surface located on an opposite side to the front surface;
- a lead wire unit including a plurality of wires electrically connected to the plurality of electrodes;
- and
- a plate member including a chip mount surface on which the semiconductor chip is mounted, amount surface located on an opposite side to the chip mount surface and fixed to an object to be measured, and a side surface located between the chip mount surface and the mount surface, to which the semiconductor chip is fixed via a joining member so that the rear surface of the semiconductor chip may face the chip mount surface,
- wherein the plate member includes a first region facing the rear surface of the semiconductor chip and a second region provided around the first region and having the side surface, and
- a thickness of the plate member in the first region is larger than a thickness in the side surface of the second region.
Dependencies are inferred from the claim text.