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AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuto OGAWA, Takashi WATANABE, Junya SHIMAKAWA
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A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.
A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal, the substrate-type terminal including a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other, the device being disposed on the first principal surface, the method comprising:
Dependencies are inferred from the claim text.