Method of producing electronic components and method of producing substrate-type terminals

A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal, the substrate-type terminal including a substrate body including a first principal surface and a second principal surface opposite to each other and including an electrode configured to be connected to the device on the first principal surface, each of the first and second principal surfaces having a rectangular or substantially rectangular shape extending in first and second directions perpendicular or substantially perpendicular to each other, the device being disposed on the first principal surface, the method comprising:

• a groove forming step of forming grooves in a substrate from a principal surface of the substrate such that the substrate is divided into the plurality of substrate-type terminals, the principal surface of the substrate being the first principal surface or the second principal surface of the substrate body, each of the grooves having a depth less than a thickness of the substrate;
• a cutting step of cutting the substrate from another principal surface opposite to the principal surface of the substrate such that the grooves penetrate through the substrate in a thickness direction thereof;
• and
• a mounting step of mounting the device on the first principal surface of the substrate body of each of the substrate-type terminals obtained by the cutting step.