Wafer level camera module and method of manufacture
AssigneeDigitalOptics Corporation
InventorHarpuneet Singh
Life of this patent
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Abstract
A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.
Claims20
A method of manufacturing a digital camera module, said method comprising:
- providing an integrated circuit chip (ICC) including an image capture sensor array;
- providing a first lens with an interlocking feature;
- bonding said first lens to a top surface of said ICC;
- forming a metallization layer on a side of said ICC opposite said first lens within the perimeter of said ICC;
- providing a second lens with a complementary interlocking feature;
- engaging said interlocking feature of said first lens with said complementary interlocking feature of said second lens;
- bonding said second lens to said first lens;
- and
- coupling one or more additional lenses configured for changing a focus distance of said camera module to said ICC.
A method of manufacturing digital camera modules, said method comprising:
- providing an image capture device (ICD) wafer including an array of ICDs, each of said ICDs including an imager;
- providing a first transparent element array including an array of first lens elements and at least one mechanical interlocking feature, ;
- positioning each first lens element over a respective one of said ICDs;
- bonding each of said ICDs to a respective one of said first lens elements;
- forming a metallization layer on a side of said ICD wafer opposite said first transparent element array;
- providing a second transparent element array including an array of second lens elements and at least one complementary mechanical interlocking feature;
- positioning said second transparent element array over said first transparent element array, with said mechanical interlocking feature of said first transparent element array engaging said complementary mechanical interlocking feature of said second transparent element array;
- bonding said second transparent element array to said first transparent element array;
- and
- dividing said first transparent element array, said second transparent element array, and said ICD wafer to form a plurality of digital camera modules each including one of said ICDs, one of said first lens elements, and one of said second lens elements.
Dependencies are inferred from the claim text.