Wire bonding capillary with working tip protrusion

Abstract

A method for bonding a wire to a substrate includes forming a wire ball at a working tip of a capillary and contacting the wire ball to a substrate via the capillary. The method also includes driving a protrusion at the working tip of the capillary into contact with a region of the substrate surrounding the wire ball. A capillary for wire bonding includes a working face, an annular chamfer section, and a cylindrical bore offsetting the annular chamfer section from the working face. A capillary for wire bonding includes a capillary body comprising a working tip having a working face. The capillary body defines an axial passage extending from the working face along a longitudinal axis of the capillary. The axial passage includes a cylindrical bore extending internally from the working face, and a first annular chamfer having a major diameter defined by the cylindrical bore.

Dependencies are inferred from the claim text.