Sputtering device
AssigneeNitto Denko Corporation
InventorsTomotake Nashiki, Akira Hamada
Life of this patent
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Abstract
A sputtering device includes a vacuum chamber; a film depositing roll; at least one target material; a gas supply mechanism; three drive rolls (downstream conveying rolls); and three temperature control mechanisms for maintaining a temperatures of the drive rolls substantially constant in a range where the temperature is 80° C. or less and is higher than a minimum temperature in the vacuum chamber so that a long film substrate that is detached from the film depositing roll and is conveyed to the downstream conveying rolls is not deformed by rapid cooling.
Claims6
A sputtering device for forming a thin layer on a surface of a long film substrate conveyed along a surface of a film depositing roll, the sputtering device comprising:
- a vacuum chamber;
- the film depositing roll disposed rotatably in the vacuum chamber;
- at least one target material that is disposed in the vacuum chamber and forms a film depositing material on the surface of the long film substrate conveyed along the surface of the film depositing roll;
- a gas supply mechanism for supplying gas into a film depositing space between the film depositing roll and the at least one target material;
- a plurality of downstream conveying rolls that are disposed downstream in a conveyance direction of the long film substrate relative to the film depositing roll in the vacuum chamber and convey the long film substrate conveyed along the surface of the film depositing roll to a downstream side of the conveyance direction;
- and
- a temperature control mechanism for maintaining a temperature of at least one of the plurality of downstream conveying rolls substantially constant in a range where the temperature is 80° C. or less and is higher than a minimum temperature in the vacuum chamber.
Dependencies are inferred from the claim text.