Magnetic Material Sputtering Target and Manufacturing Method for Same
AssigneeJX Nippon Mining & Metals Corporation
InventorsAtsutoshi Arakawa, Hideo Takami, Yuichiro Nakamura
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AssigneeJX Nippon Mining & Metals Corporation
InventorsAtsutoshi Arakawa, Hideo Takami, Yuichiro Nakamura
Estimating the term…
A magnetic material sputtering target characterized in that, in a plane for observing the oxide in the target, oxide grains in the target have an average diameter of 1.5 μm or less, and that 60% or more of the oxide grains in the observing plane of the target have a difference between a maximum diameter and a minimum diameter of 0.4 μm or less, where the maximum diameter is a maximum distance between arbitrary two points on the periphery of an oxide grain, and the minimum diameter is a minimum distance between two parallel lines across the oxide grain. A non-magnetic grain dispersion-type magnetic material sputtering target that can inhibit abnormal discharge due to an oxide causing occurrence of particles during sputtering is obtained.
A magnetic material sputtering target comprising a metal phase containing Co or Fe, and oxide grains dispersed in the metal phase, wherein, in a plane for observing the oxide in the target, the oxide grains in the target have an average diameter of 1.5 μm or less;
Dependencies are inferred from the claim text.