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US 2015/0021173 A1Published application
Sputtering device
AssigneeNitto Denko Corporation
InventorsTomotake Nashiki, Akira Hamada
Life of this patent
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Abstract
At least two gas supply pipes are connected to one gas pipe in a sputtering device. The sputtering device includes: a plurality of gas supply pipes provided outside a plurality of walls for surrounding a target, a plurality of gas pipes, and a plurality of gas supply ports each provided on an inner surface of each of the plurality of walls. The plurality of gas supply ports are each disposed on a side farther away from a film depositing roll than a surface of the target. The sputtering device further includes a plurality of cooling pipes for cooling the walls.
Claims9
A sputtering device comprising:
- a vacuum chamber;
- a vacuum pump for evacuating the vacuum chamber;
- a film depositing roll provided in the vacuum chamber;
- a target facing the film depositing roll;
- a plurality of walls for surrounding the target;
- a plurality of gas supply ports for supplying a gas in a target direction are open to inner surfaces of the plurality of walls;
- and
- a plurality of gas supply pipes connected to the plurality of gas supply ports, the plurality of gas supply pipes being provided outside the walls,
- a thin layer is formed on a long film conveyed along a surface of the film depositing roll.
6 more elements
Dependencies are inferred from the claim text.