Sputtering apparatus and method
AssigneeApplied Materials, Inc.
InventorsEvelyn Scheer, Oliver Graw
Life of this patent
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Abstract
A deposition apparatus for depositing a layer of deposition material on a substrate is provided. The apparatus includes a substrate support adapted for holding the substrate; a target support (520) adapted for holding a target assembly. The target assembly includes a backing element and at least two target elements (510, 511) arranged on the backing element next to each other so that a gap (530) is formed between the at least two target elements. The gap between the target elements is to have a width (w). Further, the substrate support and the target support are arranged with respect to each other so that the ratio of distance between substrate and target (570) element to the gap width (w) is about 150 and greater.
Claims20
Deposition apparatus for depositing a layer of deposition material on a substrate, the apparatus comprising:
- a substrate support adapted for holding the substrate;
- a target support adapted for holding a target assembly, the target assembly comprising a backing element;
- and
- at least two target elements arranged on the backing element next to each other so that a gap is formed between the at least two target elements, the gap being adapted to have a width w, wherein the substrate support and the target support are arranged with respect to each other so that the ratio of distance between the substrate and the target element to the gap width w is at least about 150.
Method for forming a layer of deposition material on a substrate in a deposition apparatus, comprising:
- providing a substrate to be coated;
- providing a target assembly comprising at least two target elements on a backing element next to each other so that a gap is formed between the at least two target elements, wherein the gap has a width w;
- and
- positioning the substrate relative to the target assembly so that the ratio of the distance between the substrate and the target element to the gap width w is at least about 150.
Deposition apparatus for depositing a layer of deposition material on a substrate, the apparatus comprising:
- a substrate support adapted for holding the substrate;
- and
- a target assembly, the target assembly comprising a backing element and at least two target elements providing the material to be deposited and being arranged on the backing element next to each other so that a gap of 0.5 mm or less is formed between the at least two target elements, wherein the distance of the substrate support and at least one of the two target elements is about 75 mm or more.
Dependencies are inferred from the claim text.