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US 2015/0021149 A1Published application
Contact structure for electromechanical switch
AssigneeIntai Technology Corp.
InventorRichard Loon SUN
Life of this patent
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Abstract
The present disclosure discloses a contact structure for electromechanical switch. The contact structure is using the design including a PCB and a moving contact to allow the actuations and have great switch characteristics whose range is from DC to high frequency.
Claims20
A contact structure for an electromechanical switch, the contact structure is capable for transmitting signal having frequency higher than 1 GHz, the contact structure comprising:
- a basic layer made of a printed circuit board and including a static contact made of a printed conducting path on an upper face;
- a top layer made of a flexible circuit board and including a moving contact made of a printed conducting path;
- a spacing layer sandwiched between the basic layer and the top layer wherein a thickness of the spacing layer defines a gap between the static contact and the moving contact and the static contact and the moving contact are parallel with each other, and
- at least one tuning circuit formed on the vicinity of the static contact and moving contact respectively;
- wherein the moving contact and the static contact are micro strip lines and each of the static contact and the moving contact has a converging portion to render a minimum overlapping area to improve isolation;
- wherein the moving contact is actuated to move and then contact the static contact for conducting a waveguide for transmitting high frequency signal and the tuning circuit compensates impedance variation induced between the moving contact and the static contact due to line width change.
3 more elements
A contact structure for an electromechanical switch, the contact structure is capable of transmitting signal having frequency higher than 1 GHz, the contact structure comprising:
- a top layer, wherein the top layers is made of a flexible circuit board and includes moving contacts made of printed conducting paths;
- a basic layer, wherein the basic layer is made of a printed circuit board and includes a static contact made of a printed conducting path on an upper face;
- a spacing layers sandwiched between the basic layer and the top layer, wherein the spacing layers defines a plurality of sub-spaces between the basic layer and the top layer, each of the moving contacts of the top layer is located in each of the sub-spaces, a thickness of the spacing layers defines a gap between the static contact and each of the moving contacts, and the static contact and each of the moving contacts are parallel with each other;
- and
- at least two RF layers stacked under the basic layer, wherein each of the RF layers is made of a printed circuit board and one of the RF layers includes a trace made of a printed conducting path on an upper face;
- wherein the static contact of the basic layer is electrically connected to the trace of the RF layer by at least two RF interconnections;
- when each of the moving contacts of the top layer is individually or synchronously actuated to move and contact the static contact of the basic layer, at least a waveguide is produced for transmitting high frequency signals, and the high frequency signals are transmitted from the basic layer to the RF layers through at least one of the RF interconnections.
4 more elements
Dependencies are inferred from the claim text.