Copper clad laminate, printed circuit board, and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Ho Ko, Chang Jae Lee, Jun Ho Kang, Seok Jun Ahn
Life of this patent
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Abstract
Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.
Claims30
A copper clad laminate comprising:
- an insulating layer having one surface and the other surface;
- and
- first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively,
- wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.
A printed circuit board comprising:
- an insulating layer having one surface and the other surface;
- first and second circuit layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively;
- and
- a first via connecting the first and second circuit layers to each other while penetrating through the insulating layer,
- wherein one surface of the insulating layer contacts the rough surface of the first circuit layer and the other surface of the insulating layer contacts the smooth surface of the second circuit layer.
A printed circuit board comprising:
- an insulating layer having one surface and the other surface;
- a first circuit layer formed on one surface of the insulating layer;
- a second circuit layer formed on the other surface of the insulating layer;
- a first build-up layer formed on the insulating layer and the first circuit layer and including a first build-up insulating layer and a first build-up circuit layer;
- a second build-up layer formed on the insulating layer and the second circuit layer and including a second build-up insulating layer and a second build-up circuit layer;
- and
- a via formed in at least one of the insulating layer, the first build-up layer, and the second build-up layer,
- wherein the first circuit layer, the second circuit layer, the first build-up circuit layer, and the second build-up circuit layer have one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, and the rough surfaces of the first circuit layer, the second circuit layer, and the first build-up circuit layer face the rough surface of the second build-up circuit layer.
A method of manufacturing a printed circuit board, comprising:
- preparing copper clad laminates including an insulating layer having one surface and the other surface and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, one surface of the insulating layer contacting the rough surface of the first copper foil layer and the other surface of the insulating layer contacting the smooth surface of the second copper foil layer;
- stacking the copper clad laminates on both surfaces of a carrier substrate so that rough surfaces of the copper clad laminates face each other;
- forming a first via hole in the copper clad laminate;
- performing plating on the first via hole and the first copper foil layer to form a first via and a first plating layer;
- removing the carrier substrate;
- patterning the first plating layer and the first copper foil layer to form a first circuit layer;
- and
- patterning the second copper foil layer to form a second circuit layer.
Dependencies are inferred from the claim text.