Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

A printed circuit board having a multilayer ceramic electronic component embedded therein, the printed circuit board comprising:

• an insulating substrate;
• and
• the multilayer ceramic electronic component including, a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other;
• an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein;
• upper and lower cover layers formed on upper and lower portions of the active layer;
• and first and second external electrodes formed on both end surfaces of the ceramic body, wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and when a thickness of the upper or lower cover layer is defined as tc, 4 μm≦tc≦20 μm is satisfied.