Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

A multilayer ceramic electronic component to be embedded in a board, comprising:

• a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other;
• first and second internal electrodes stacked with the dielectric layers interposed therebetween while being spaced apart from the end surfaces of the ceramic body by predetermined distances, and having first and second lead portions exposed through at least one of the first and second side surfaces of the ceramic body;
• and
• first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second main surfaces and the first and second side surfaces, respectively,
• wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion and adjacent to the end portion of the first or second external electrode formed on the first or second side surface is defined as G, a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, and a distance from each end surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion and adjacent to the end surface of the ceramic body is defined as M, 50 μm≦M<BW-G is satisfied.

A multilayer ceramic electronic component to be embedded in a board, comprising:

• a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other;
• first and second internal electrodes stacked with the dielectric layers interposed therebetween while being spaced apart from the end surfaces of the ceramic body by predetermined distances, and having first and second lead portions exposed through the first and second side surfaces of the ceramic body;
• and
• first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second main surfaces and the first and second side surfaces, respectively,
• wherein the first and second external electrodes are electrically connected to the first and second internal electrodes on the side surfaces of the ceramic body, respectively, and an average thickness of the first and second external electrodes formed on the first and second side surfaces of the ceramic body is equal to or greater than 5 μm.