Back to results
US 2015/0021075 A1Published application
Surface-mounting substrate
AssigneeFuji Electric Fa Components & Systems Co., Ltd.
InventorsKokichi OKAMOTO, Takahiro TAGUCHI
Life of this patent
Estimating the term…
Abstract
A surface mounting substrate for surface mounting an electronic part using a lead-free solder includes a joint portion of the substrate to which the electronic parts is joined; and a stress relaxation portion formed in a vicinity of the joint portion of the substrate.
Claims4
A surface mounting substrate for surface-mounting an electronic part using a lead-free solder, comprising:
- a joint portion of the substrate to which the electronic part is adapted to be joined;
- and
- a stress relaxation portion formed in a vicinity of the joint portion.
Dependencies are inferred from the claim text.