Printed circuit board and manufacture method thereof

Abstract

Disclosed herein is a printed circuit board capable of implementing slimness by decreasing the number of entire layers through an asymmetrical build-up structure in which an electric device is embedded, the printed circuit board including: a core layer including a cavity formed therein so that an electric device is embedded and a circuit pattern and a pad formed on upper and lower surfaces thereof; a through via formed in the core layer so as to connect the upper and the lower pads of the core layer to each other; a plurality of insulating layers built-up on the core layer and including a plurality of vias so as to be electrically connected to the through via; and a solder resist layer applied onto a lower portion of the core layer so that a lower surface of the through via is partially exposed.

Dependencies are inferred from the claim text.