Circuit board, conductive film forming method and adhesiveness improver
AssigneeIshihara Chemical Co., Ltd.
InventorsYuichi Kawato, Tomohiro Mita, Yusuke Maeda, Tomio Kudo
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Abstract
In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved. A circuit board includes a circuit including a conductive film, and a substrate. The circuit board further includes a resin layer between the substrate and the conductive film. The substrate is made of a non-thermoplastic base material. The resin layer contains a thermoplastic resin. The conductive film is formed by photo sintering of a film composed of copper particulates, and thus improving adhesiveness of the conductive film to the base material through the resin layer.
Claims9
1-10. (canceled)
A circuit board comprising a circuit including a conductive film, and a substrate, which further comprises:
- a resin layer between the substrate and the conductive film, wherein
- the substrate is made of a non-thermoplastic base material,
- the resin layer contains a thermoplastic resin, and
- the conductive film is formed by photo sintering of a film composed of copper particulates.
A conductive film forming method in which a conductive film is formed on a base material, which comprises the steps of:
- forming a resin layer on a non-thermoplastic base material using an adhesiveness improver containing a thermoplastic resin,
- forming a film composed of copper particulates on the resin layer using a copper particulate dispersion, and
- subjecting the film to photo sintering.
Dependencies are inferred from the claim text.