Wiring board and method for manufacturing wiring board
AssigneeIbiden Co., Ltd.
InventorsTakenobu NAKAMURA, Yoshiaki Mori, Yu Sasaki
Life of this patent
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Abstract
A wiring board includes an insulation layer, and a conductive pattern formed on the insulation layer having a repaired disconnected portion. The repaired disconnected portion has a first conductive layer connecting disconnected edges of the conductive pattern and a second conductive layer covering the first conductive layer, the first conductive layer has a first electrical resistivity which is set higher than an electrical resistivity of the conductive pattern, and the second conductive layer has a second electrical resistivity which is set lower than the first electrical resistivity of the first conductive layer.
Claims20
A wiring board, comprising:
- an insulation layer;
- and
- a conductive pattern formed on the insulation layer having a repaired disconnected portion,
- wherein the repaired disconnected portion has a first conductive layer connecting disconnected edges of the conductive pattern and a second conductive layer covering the first conductive layer, the first conductive layer has a first electrical resistivity which is set higher than an electrical resistivity of the conductive pattern, and the second conductive layer has a second electrical resistivity which is set lower than the first electrical resistivity of the first conductive layer.
A method for manufacturing a wiring board, comprising:
- applying a conductive paste including metal particles to a disconnected portion of a conductive pattern such that a layer of the conductive paste is formed between disconnected edges of the disconnected portion of the conductive pattern;
- drying the layer of the conductive paste formed between the disconnected edges of the disconnected portion such that a conductive-paste layer having a first electrical resistivity which is set higher than an electrical resistivity of the conductive pattern is formed between the disconnected edges of the disconnected portion;
- and
- electrolytically plating the conductive-paste layer using the conductive-paste layer as a power-supply layer such that a plated layer having a second electrical resistivity which is set lower than the first electrical resistivity of the conductive-paste layer is formed to cover the conductive paste layer.
Dependencies are inferred from the claim text.