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AssigneeTelefonaktiebolaget L M Ericsson (publ)
InventorsPer Hillstrom, Mikael Fardig, Daniel Fredriksson, Sofia Olsson
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The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part. The housing comprises at least one ventilation opening to prevent build-up of negative pressure inside the housing, where the ventilation opening is covered by a protective covering comprising a through opening. The through opening is arranged to allow water to flow through the through opening, thereby preventing a build up of pressure inside the protective covering. A method for manufacturing a housing according to the invention is also disclosed.
A housing for electronic components, the housing comprising at least a front housing part and a rear housing part, the front housing part and the rear housing part being arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part;
A method for manufacturing a housing for electronic components, the housing comprising at least a front housing part and a rear housing part, the front housing part and the rear housing part being arranged to be sealed by means of a sealing gasket upon attaching the front housing part to the rear housing part;
Dependencies are inferred from the claim text.