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US 2015/0020967 A1Published application
Substrate processing apparatus
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsTakashi OTA, Yuya AKANISHI, Akio HASHIZUME
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Abstract
A substrate processing method includes a water removing unit for removing water from a substrate, a silylating agent supplying unit for supplying a silylating agent to the substrate and an etching agent supplying unit for supplying an etching agent to the substrate. A control unit controls the said units to execute a water removing step, a silylating step and an etching step in that order.
Claims17
A substrate processing apparatus comprising:
- a water removing unit that is configured to remove water from a substrate;
- a silylating agent supplying unit that is configured to supply a silylating agent to the substrate;
- an etching agent supplying unit that is configured to supply an etching agent to the substrate;
- and
- a control unit that is programmed and configured to execute a water removing step of removing water from the substrate by controlling the water removing unit, to execute a silylating step of supplying the silylating agent to the substrate after the water removing step by controlling the silylating agent supplying unit, and to execute an etching step of supplying the etching agent to the substrate after the silylating step by controlling the etching agent supplying unit.
2 more elements
Dependencies are inferred from the claim text.