Multi-layer 3d pattern manufacturing method and manufacturing apparatus thereof
AssigneeSuntek Precision Corp.
InventorCHIEN-MIN CHANG
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Abstract
A multi-layer 3D pattern manufacturing method includes the steps of forming a color film on a surface of a substrate or a third pattern structure by providing a chromogenic material by lithography, gravure, flexographic printing, screen printing and physical vapor deposition in a transcribed printing process. Using the color film to match with different 3D pattern structures to form a multilayer 3D pattern which can be applied to the housing of various different electronic products not only can improve the aesthetic appearance, it can also enclose the color film within the 3D pattern to prevent the 3D pattern from falling off or fading; thus, the lifetime of the pattern can be improved.
Claims10
A multi-layer 3D pattern manufacturing method, comprising:
- providing a mother board, a sub-film and a substrate, wherein the mother board is processed with an anti-adhesion process and has a first pattern structure, and the sub-film is made of a translucent material and has a first light curing adhesive coated on a side of the sub-film;
- rolling and laminating the sub-film with the mother board, and then forming a second pattern structure on the sub-film after a transcribed printing process and a light curing process;
- de-molding the sub-film and the mother board;
- providing a chromogenic material, and forming a color film on a surface of the substrate;
- coating a second light curing adhesive on the color film;
- transferring and printing the second pattern structure onto the second light curing adhesive, such that the color film is included between the substrate and the second light curing adhesive, while simultaneously light curing the second light curing adhesive to form a third pattern structure having a multi-layer pattern;
- providing a mold, and heating the substrate simultaneously, so that the substrate and the third pattern structure are extensible;
- using the mold to punch and shape the substrate and the third pattern structure, and the extensible substrate and third pattern structure will not be cracked by punching;
- and
- processing the substrate with an illumination treatment.
A multi-layer 3D pattern manufacturing method, comprising:
- providing a mother board, a sub-film and a substrate, wherein the mother board is processed with an anti-adhesion treatment and having a first pattern structure, the sub-film is made of a translucent material, and a first light curing adhesive is coated on a side of the sub-film, and a second light curing adhesive is coated on a side of the substrate;
- rolling and laminating the sub-film with the mother board, and forming a second pattern structure on the sub-film after a transfer printing process and a light curing process;
- de-molding the sub-film and the mother board;
- transfer-printing the second pattern structure onto the second light curing adhesive, while simultaneously light curing the second light curing adhesive to from a third pattern structure;
- providing a chromogenic material, and forming a color film onto the third pattern structure;
- coating a third light curing adhesive onto the color film;
- transcribing and printing the second pattern structure onto the third light curing adhesive, so that the color film is included between the third pattern structure and the third light curing adhesive, while simultaneously light curing the third light curing adhesive to form a fourth pattern structure with a multi-layer 3D pattern;
- providing a mold, while simultaneously heating the substrate, so that the substrate and the fourth pattern structure are extensible;
- using the mold to punch and shape the substrate, the third pattern structure and the fourth pattern structure, and the extensible substrate, the third pattern structure and the fourth pattern structure will not be cracked by punching;
- and
- processing the substrate with an illumination treatment.
Dependencies are inferred from the claim text.