Cleaning method for thin-film processing applications and apparatus for use therein
AssigneeApplied Materials, Inc.
InventorsFlorian RIES, Stefan HEIN, Stefan LORENZ, Neil MORRISON, Tobias STOLLEY
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Abstract
According to the present disclosure, a method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking the vacuum in the processing chamber is provided. The method for cleaning the processing chamber includes guiding a sacrificial foil into the processing chamber; initiating a first pump process in the processing chamber; plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber; initiating a second pump process in the processing chamber; and guiding a flexible substrate into the processing chamber.
Claims19
A method for cleaning the processing chamber of a flexible substrate processing apparatus without breaking vacuum in the processing chamber, the method comprising:
- guiding a sacrificial foil into the processing chamber;
- initiating a first pump process in the processing chamber;
- plasma cleaning the processing chamber while the sacrificial foil is provided in the processing chamber;
- initiating a second pump process in the processing chamber;
- and
- guiding the sacrificial foil out of the processing chamber.
A roll comprising a flexible substrate for use in an apparatus for processing a flexible substrate, wherein the flexible substrate comprises a sacrificial foil attached thereto.
Dependencies are inferred from the claim text.