Method for Crimping Terminal to Wire and Crimping Terminal
AssigneeYazaki Corporation
InventorToshihiko Yamamoto
Life of this patent
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Abstract
There is provided a method for crimping a crimping terminal to a wire. The crimping terminal includes a conductor crimping part configured to crimp a conductor part of the wire. A thermoplastic resin layer is formed on an area of an inner surface of the conductor crimping part so as to define a contact area on which the thermoplastic resin layer is not formed. The conductor crimping part, on which the thermoplastic resin layer is formed, is crimped to the conductor part so that the contact area comes in contact with the conductor part. The conductor crimping part crimped to the conductor part is heated at a temperature at which the thermoplastic resin layer is melted. The contact area is surrounded by the thermoplastic resin layer so as to be sealed after the heating.
Claims2
A method for crimping a crimping terminal to a wire, the crimping terminal including a conductor crimping part configured to crimp a conductor part of the wire, the method comprising:
- forming a thermoplastic resin layer on an area of an inner surface of the conductor crimping part so as to define a contact area on which the thermoplastic resin layer is not formed;
- crimping the conductor crimping part, on which the thermoplastic resin layer is formed, to the conductor part so that the contact area comes in contact with the conductor part;
- and
- heating the conductor crimping part crimped to the conductor part at a temperature at which the thermoplastic resin layer is melted,
- wherein the contact area is surrounded by the thermoplastic resin layer so as to be sealed after the heating.
Dependencies are inferred from the claim text.