Electronic circuit arrangement and method of manufacturing the same

A method of manufacturing an electronic circuit arrangement comprising an electrical circuit, the method comprising:

• providing a substrate comprising a conductive or semi-conductive main portion and having a first surface and a second surface,
• providing an electrical connection part for providing an electrical connection to the electronic circuit and being arranged on the first surface,
• providing in the substrate at least one through-hole extending from the first surface to the second surface, wherein the through-hole comprises a first portion open to the first surface and having a first diameter and a second portion open to the second surface and having a second diameter bigger than the first diameter,
• covering at least the sidewalls of the first portion of the through-hole with and isolating layer,
• arranging at least one electrical wire through the through-hole, electrical wire comprising a single conductive core and an isolation surrounding the conductive core, wherein an end portion of the electrical wire is an isolation-free portion for allowing access to the conductive core, and wherein the first diameter of the first portion of the through-hole is equal or bigger than a diameter of the conductive core and smaller than a diameter of the isolation, and
• connecting the end portion of the electrical wire to the electrical connection part.