A flexible cap for facilitating assembly of an electronic component of an electronic device, said component having at least one elongated stud-like connecting member with a first male snap connection portion providing a detachable connection between said male and a female snap, and a second and opposite end portion forming a second terminal end said stud and providing an electrical connection between an electronic device to said female snap, wherein said cap is made of a conductive sheet material and having a generally horizontal top surface, at least two generally vertical side elements each of which is formed as a leg joined to said top surface by a first bend of said sheet material, whereby the cap is adapted to create an electrical connection and a mechanical lock between said electronic component and an aperture of a printed circuit board of said electronic device on the other hand, by flexible deformation of said side members when said connecting member is slided into said cap and passed through said aperture of said printed circuit board.