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US 2014/0371562 A1Published application
Solderable flexible electrode and method for manufacturing same
AssigneeKorea University Research and Business Foundation
InventorsSang Hoon Lee, Gi-Seok Jeong, Dong Hyun Baek, Hachul Jung
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Abstract
The present disclosure relates to a flexible electrode and a method for manufacturing the same, more particularly to a flexible electrode which has good flexibility and biocompatibility as well as good solderability for attachment of electronic parts and, hence, is widely applicable in such fields as ubiquitous healthcare monitoring and a method for manufacturing the same.
Claims12
A flexible electrode comprising:
- a porous polymer support layer:
- a first metal deposition layer formed on the porous polymer support layer;
- a second metal deposition layer formed on the first metal deposition layer;
- and
- a metal plating layer formed on the second metal deposition layer.
2 more elements
A method for manufacturing a flexible electrode, comprising:
- forming a polymer support layer on a substrate;
- forming a porous polymer support layer from the polymer support layer;
- forming a first metal deposition layer on the porous polymer support layer;
- forming a second metal deposition layer on the first metal deposition layer;
- and
- forming a metal plating layer on the second metal deposition layer.
3 more elements
Dependencies are inferred from the claim text.