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US 2014/0370788 A1Published application
Low surface roughness polishing pad
OwnerJayakrishnan NAIRinventor
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Abstract
The invention provides a polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 μm to about 10 μm.
Claims9
A polishing pad comprising a polishing pad body comprising a polishing surface, wherein the polishing body comprises pores, and wherein the polishing surface has a surface roughness of about 0.1 μm to about 4 μm.
Dependencies are inferred from the claim text.