Polishing liquid for metal and polishing method
AssigneeHitachi Chemical Company, Ltd.
InventorsYasuhiro Ichige, Kouji Haga, Seiichi Kondo
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Abstract
The present invention relates to a metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising, component A: a metal solubilizer containing amino acids, component B: compounds having the benzotriazole skeleton, and component C: an acrylic acid polymer having the weight average molecular weight of 10,000 or more, and having the mass ratio between the component B and the component C, (component B:component C), to be 1:1 to 1:5. Use of the metal polishing liquid can simultaneously yield high polishing rates and low etching rates at higher level, enabling to form an embedded pattern with higher reliability.
Claims5
A metal polishing liquid for polishing at least a part of metal in a substrate having the metal, comprising
- component A:
- a metal solubilizer containing an amino acid;
- component B:
- a compound having the benzotriazole skeleton;
- and
- component C:
- an acrylic acid polymer having the weight average molecular weight of 10,000 or more,
- wherein the mass ratio between the component B and the component C, (component B:component C), is 1:1 to 1:5.
Dependencies are inferred from the claim text.