Method for Producing a Semiconductor Module
AssigneeInfineon Technologies AG
InventorsReinhold Bayerer, Winfried Luerbke
Life of this patent
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Abstract
A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of the bonding device, a bonding connection is produced between the metallization and a first section of the wire. A separating location and a second section of the wire, the second section being spaced apart from the separating location, are defined on the wire. The wire is reshaped in the second section. Before or after reshaping, the wire is severed at the separating location, such that a terminal conductor of the semiconductor module is formed from a part of the wire. The terminal conductor is bonded to the metallization and having a free end at the separating location.
Claims25
A method for producing a semiconductor module, the method comprising:
- providing a circuit carrier having a metallization layer, an electrically conductive wire and a bonding device;
- producing a bonding connection between the metallization layer and a first section of the wire by means of the bonding device;
- defining a separating location of the wire;
- defining a second section of the wire which is spaced apart from the separating location;
- reshaping the wire in the second section;
- severing the wire at the separating location such that a terminal conductor of the semiconductor module is formed from a part of the wire, the terminal conductor being bonded to the metallization layer and having a free end at the separating location.
A method for producing a semiconductor module, the method comprising:
- providing a circuit carrier having a metallization layer, a terminal conductor having a first end section and a second end section opposite to the first end section, and a bonding device;
- producing a bonding connection between the metallization layer and the first end section by means of the bonding device;
- and
- subsequently bending over the second end section relative to the circuit carrier by a bending angle that is greater than or equal to 20° and less than or equal to 80°.
A method for producing a semiconductor module, the method comprising:
- providing a circuit carrier having a metallization layer;
- providing a terminal conductor (49) having:
- a first section composed of an electrically conductive first material;
- a second section composed of an electrically conductive second material different than the first material, the second section being cohesively connected to the first section indirectly or directly;
- a first end section and a second end section opposite to the first end section, the first end section being formed by a part of the first section and the second end section being formed by a part of the second section;
- providing a bonding device;
- providing a module housing;
- producing a bonding connection between the metallization layer and the first section by means of the bonding device in such a way that the first end section is directly connected to the metallization layer;
- and
- arranging the circuit carrier in the module housing after producing the bonding connection in such a way that the second end section projects from the module housing.
Dependencies are inferred from the claim text.