Back to results
US 2014/0370660 A1Published application
Semiconductor device and method of manufacturing the same
AssigneeFujitsu Semiconductor Limited
InventorTakumi IHARA
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, and a heat conductive member composed of a solder material. The heat conductive member covers the semiconductor element, and is connected to a connection pad formed on the substrate. A heat radiator is disposed on the heat conductive member. The heat conductive member thermally connecting the semiconductor element to the heat radiator reduces the risk that electromagnetic noise may be emitted from or may be incident on the semiconductor element.
Claims6
A method of manufacturing a semiconductor device, the method comprising:
- placing a semiconductor element on a substrate having an electrode portion formed thereon;
- placing a heat radiator on the semiconductor element with a heat conductive member interposed therebetween, the heat conductive member being composed of a solder material;
- and
- pressing the heat radiator such that the heat conductive member covers the semiconductor element and such that the heat conductive member is connected to the electrode portion.
1 more element
Dependencies are inferred from the claim text.