Singulation apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCHUN-CHENG LIN, YU-PENG TSAI, MENG-TSE CHEN, MING-DA CHENG, CHUNG-SHI LIU
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Abstract
A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process.
Claims20
A singulation apparatus comprising:
- a carrier including a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site, wherein a top surface of the carrier is configured to receive a semiconductor substrate thereon;
- and wherein each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole, wherein the at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied.
A singulation apparatus comprising:
- a carrier having a deformable portion proximate to a top surface of the carrier configured to receive a semiconductor substrate;
- a plurality of through holes in the carrier with one end from the top surface;
- and
- a plurality of chucks in the plurality of vacuum holes, wherein each of the plurality of chucks has a first surface configured to support the semiconductor substrate when the deformable portion is deformed.
A method of manufacturing semiconductor devices, the method comprising:
- placing a semiconductor substrate on a top surface of a carrier;
- introducing vacuum into a plurality of vacuum holes in the carrier to form a seal between the semiconductor substrate and a deformable portion of the carrier;
- and
- singulating the semiconductor substrate into a plurality of semiconductor devices.
Dependencies are inferred from the claim text.