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US 2014/0370451 A1Published application
Heating apparatus and heating method
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTsutomu Sahoda, Yoshiaki Masu, Hidenori Miyamoto, Yubun Kikuchi
Life of this patent
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Abstract
A heating apparatus including: a heating part which heats a substrate having coated thereon a liquid material containing a metal and a solvent, and a thermocouple which is disposed to contact a portion of the heating part and has at least a surface of a contact portion contacting the heating part covered with a protection film.
Claims10
A heating apparatus comprising:
- a heating part which heats a substrate having coated thereon a liquid material comprising a metal and a solvent, and
- a thermocouple which is disposed to contact a portion of the heating part and has at least a surface of a contact portion contacting the heating part covered with a protection film.
Dependencies are inferred from the claim text.