Method of encapsulating an electrical energy accumulation component and battery

A method, comprising:

• placing a circuit device between two parts of a mold, said circuit device having two opposite and parallel main faces and a peripheral edge, at least one main face having a first electrical contact in a first device corner and a second electrical contact in a second device corner, said mold comprising an injection chamber delimited between the two parts of the mold, said circuit device extending in the injection chamber at a distance from walls of the injection chamber, wherein a portion of the circuit device, adjacent to the peripheral edge, is held in a centering space formed between said two parts of the mold and at least partially covering said first and second electrical contacts, said two parts of the mold further comprising opposite positioning studs protruding into said injection chamber and bearing on said main faces of the circuit device;
• injecting an encapsulation material into said injection chamber;
• hardening said injected encapsulation material to form an encapsulation block;
• and
• removing the encapsulated circuit device from the mold.

A mold, comprising:

• a first part;
• and
• a second part;
• said first and second parts configured to define an injection chamber delimited between the first and second parts, said injection chamber sized and shaped to receive a device including top and bottom surfaces and a first device corner and a second device corner;
• wherein the first and second parts of the mold are further configured with a structure that centers the received device within the injection chamber, said structure that centers comprising angle structures configured to retain side edges of the device at the first and second device corners and clamping structures configured to clamp against the top and bottom surfaces of the device at the first and second device corners.